Providing communication system design engineers with an economical and space-saving network that can provide termination for high speed memory buses and decoupling for high frequency data line drivers, TT electronics BI Technologies Electronic Components Division recently developed the Model BB1110RC resistor-capacitor network. The high-density flip chip BGA-mounted device includes nine resistors and nine chip capacitors integrated on a single substrate.

According to Mike Torres, product manager for BI Technologies Electronic Components Division, the networks were designed for high-frequency/high-speed termination and decoupling. "The two-sided networks feature solder balls on one side and components on the other side. Connection is accomplished with solid-filled vias that provide an excellent electrical contact path," Torres said. "This unique network construction yields extremely low capacitance and inductance parasitics that are critical for high-speed applications."

The Model BB1110RC integrated resistor-capacitor networks feature nine 50W resistors in series with nine X5R 10V/0.1mF capacitors in a center-bussed schematic. Resistor tolerance is ±1%, capacitor tolerance is ±10%, and TCR is 200ppm/°C.

Resistor power rating is 0.05W at 70°C, and the overall package power rating is 1.0W at 70°C. Operating temperature range is -55°C to +85°C.

The BGA network employs 27 high-temperature solder balls in a 3 x 9 array that will not collapse during board mounting, Torres continued, using industry-standard ball diameter and 1.0mm pitch. Overall package dimensions are 9mm x 3mm with a board-mounted profile of 2.40mm.

Typical pricing for the Model BB1110RC Networks is $1.00 in medium range volumes, with lead times from stock to 8 weeks.